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TMCNet: MEMS: CMOS Image Sensors Technologies & Markets - 2010 Report

[March 15, 2010]

MEMS: CMOS Image Sensors Technologies & Markets - 2010 Report

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/ff6c2a/mems_cmos_image_s) has announced the addition of the "MEMS: CMOS Image Sensors Technologies & Markets - 2010 Report" report to their offering.

MEMS: CMOS Image Sensors Technologies & Markets - 2010 Report Disruptive technologies pave the way to the future of digital imaging industry Market trends Image sensors have come a long way since the first introduction of CCD sensor technology in the 1990s. They made a big jump in the 2000s with the introduction of CMOS sensor technology which gave birth to the low-cost, high volume camera phone market.

Image sensors are now part of our everydays life: from cell-phone cameras, to notebook webcams, digital cameras, video camcorders to security & surveillance systems. In the future, new markets are also emerging such as sensors for medical applications, automotive safety features but also gaming and home TV webcams The reason why we are now releasing the first report on CMOS image sensor industry is that we feel that we are at an historic turning point of this young, but still maturing industry.

Indeed, from 2010 and toward the next decade, the time has come that high-end and low-end markets start converging: digital cameras are on the way to get real HD video camcorder features. Meanwhile, camera cell-phones with auto-focus capability are on the way to get real digital still camera features along with basic video recording functionality.

As these markets will progressively converge, key enabling technologies will be developed and are paving the way to the future growth of digital imaging industry: - CMOS sensor technology will continue to expand and finally take the advantage in the remaining CCD application space as soon as 300mm infrastructure will build-up in Asia and BSI CMOS technology will be made available.

- In the high-end camera phone market segment, disruptive new camera module concepts including Auto-focus, Zoom and Image stabilization features will be developed and introduced to the market.

- In the ultra-competitive low-end market, the race toward Wafer Level Cameras and digital autofocus features such as eDoF (extended Depth of Focus) will enable the few remaining image sensor players to preserve their margins in this aggressive and cost driven market.

- Future CIS markets such as medical and automotive sensor applications will re-use extensively all these newly developed concepts (BSI, WLCamera, digital zoom) plus will need new features to be developed such as High Dynamic Range and NIR capability.

Key features of the study The objectives of this first report are the following: To provide market data on CMOS image sensor key market metrics & dynamics: - CMOS image sensor unit shipments, revenues and wafer production by application - Market shares with detailed breakdown for each player - Application focus on key areas of growth for CMOS image sensor (handsets, DS C/SLR, medical, automotive, security & surveillance, etc ) To provide key technical insight about future technology trends & challenges: - From BSI (Backside illuminated sensor) and other front-end technologies evolution (Pixel isolation, color filters, micro-lenses) to WLC (Wafer Level Cameras) realization with wafer level optics, Packaging / Assembly & Test (Wafer Level Packaging and 3D TSV interconnects), WDR (Wide dynamic Range) sensor technologies, Image stabilization & Auto-focus technologies (eDoF, Piezo, other mechanical AF , MEMS based, WL Auto-focus or liquid lenses) To provide a deep understanding of CIS value chain, infrastructure & players: - Who are the CMOS image sensor players (IDMs, foundries, design houses) and how are they related? - What are the key suppliers and emerging infrastructure for BSI, Wafer Level Cameras, and future optical camera module technologies? Who should buy this report ? CMOS image sensor manufacturers: - Evaluate market potential of future technologies and products for new applicative markets - Screen potential new suppliers for introducing new disruptive technologies such as BSI, new pixel architectures, Wafer level camera, Auto-focus & image stabilization for camera modules - Monitor and benchmark your competitors advancements CMOS & Packaging Foundries: - Spot new opportunities and define diversification strategies - Position your company in the moving CMOS imaging value chain Assembly & Test Service companies: - Get the list of the Top CMOS image sensor players - Understand the impact of new optical assembly technologies such as wafer level cameras Equipment & Material manufacturers: - Understand the evolution of image sensor and camera module value chain - Understand the differentiated value of your product and technology in this market - Identify new business opportunities and prospects Electronic module makers & Original Equipment Makers: - Evaluate the benefits of using these new technologies in your end system - Screen and select new image sensor suppliers Financial & Strategic investors: - Understand the potential of new imaging technologies such as BSI, WLOptics and MEMS Auto-focus - Get the list of main key players and emerging startups of this industry Key Topics Covered: Objectives & Scope of the report Executive Summary 1) Introduction & Background - CCD versus CMOS sensors 2) Market forecasts & Supply Chain - 2007-2015 CMOS image sensor forecasts - - Shipments forecasts (in Munits) - - Revenues forecasts (in $M) - - Wafer production forecasts (in wafer size eq.) - Global CMOS image sensor manufacturing infrastructure & Supply value chain - 2009 market shares (both in unit shipments, wafer production and revenues) 3) Application Focus - Automotive sensors - - Applications, specifications, markets & supply chain - Security & Surveillance sensors - - Applications, specifications, markets & supply chain - Medical sensors - - Applications, specifications, markets & supply chain - Industrial & Machine vision sensors - - Applications, specifications, markets & supply chain 4) New Design & Front-end technology development - High Dynamic Range sensor technologies - Color filters, Micro-lenses array & AR coatings - Substrate & Pixel isolation technologies 5) Camera module Packaging, Assembly & Test technologies - Packaging solutions overview: COB, CCM - Focus on WLP & 3D TSV integration trends 6) BSI 'Backside illumination' technology development - Motivations & applications for BSI sensors - Technologies for BSI manufacturing - - Initial substrate techno (SOI or Bulk Silicon)? And manufacturing infrastructure (200mm or 300mm?) - - Pixel isolation technologies, Thickness of final active silicon - - Type of bonding technology between wafer carrier and the active silicon? - - Grinding technologies (CMP, mechanical plus dry etching) and Etch stop layer choice for backside exposure (oxide, implant gradient) - - QE specifications targets. Specific backside passivation in order to decrease the dark current? Anti reflective coating technologies - Players & status of commercialization - Future approach: 3D integrated image sensors 7) WLC Wafer Level Camera technology development - WLOptics technologies - - From lens formation, stacking to final molding - Market status, players & supply chain - Test issues & challenges 8) Optical Zoom, Image Stabilization & Autofocus technologies - New autofocus technologies (eDoF, Piezo, MEMS, Liquid Lens, LC): technical trends & players - Image stabilization: technologies & players - Micro-zoom: technologies & players Conclusions & Perspectives Appendix - Yole Dveloppement presentation Companies Mentioned: - Advasense - Altasens - Anafocus - Anteryon - Aptina Imaging - Artificial Muscle - Asahi Glass - Awaiba - AWLP - BC Tech - BEIKimco magnetic - Bosch - Cambridge Mechatronics - Canesta - Canon - Ceradyne - China WLCSP - CMOSIS - Continental - Crysview - Cypress - DA LSA - DBlur - Delphi - Dongbu HiTek - DXO-Lab - e2v - Espon-Toyocom - Forza Silicon - Foveon - Foxconn - Fujinon - Fujitsu - GalaxyCore - Grace Semiconductor - Given Imaging - Hamamatsu - Hella - Heptagon - Himaximaging - HHNE C - Hoya - Hynix - Invensense - Jabil - JCAP - Kantatsu - Kodak - Kolen - Konica Minolta - Kostal - KunShanRuiXin Micro - Largan - Lensvector - LG Innotek - Live Technologies - Medigus - Melexis - MGB Endoscopy - Micro-ImagingSolutions - Mitsumi - Murata - NE C / Schott - Nemotek - New Imaging Technologies - New scale technologies - Novatek - Omnivision - Omron - Optotune - OptoPac - Panasonic - PlanOptik - Phillips - Pixart - PixelPlus - Pixim - poLight - PGS PrecisionPte - Q-Technology - Qualtre - Rad-icon - Rhevision - Retinal Implant - Saint-Gobain - Samsung - Sarnoff - Schott - Seiko - SE MCO - Senodia - SE Ti - Sharp - Sightic - Siimpel - SiliconFile - SMIC - SOITEC - Sony - STMicro - SuperPix - Tessera - TexasInstruments - Toshiba - Trixel - TSMC - TowerJazz - UMC - Valeo - Valtronic - Varioptic - Vasstek - Vista Point - Viti - X-Fab - Xceed Imaging - XinTec - Zarlink - Ziptronix.

For more information visit http://www.researchandmarkets.com/research/ff6c2a/mems_cmos_image_s ((Comments on this story may be sent to info@m2.com)) (c) 2010 M2 COMMUNICATIONS

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